U.S. patent number 3,971,125 [Application Number 05/554,390] was granted by the patent office on 1976-07-27 for method of making an antenna array using printed circuit techniques.
This patent grant is currently assigned to Raytheon Company. Invention is credited to Wilbur H. Thies, Jr..
| United States Patent |
3,971,125 |
| Thies, Jr. |
July 27, 1976 |
Method of making an antenna array using printed circuit
techniques
Abstract
Radio frequency array antenna structures and methods for
fabricating such structures are disclosed wherein a plurality of
radio frequency circuits forming the radiating face of an array
antenna and a corporate feed are formed on one or more relatively
flexible dielectric sheets and then bonded to a suitable core
material to form a complete array structure which is light weight,
inexpensive and structurally sound.
|
Inventors: |
Thies, Jr.; Wilbur H. (Santa
Barbara, CA) |
|
Assignee: |
Raytheon Company (Lexington,
MA)
|
| Family
ID: |
24213150 |
| Appl.
No.: |
05/554,390 |
| Filed: |
March 3, 1975 |
| Current U.S.
Class: |
29/601; 342/371;
343/769 |
| Current CPC
Class: |
H01Q
1/38 (20130101); H01Q 9/0457 (20130101); H01Q
21/0075 (20130101); Y10T 29/49018 (20150115) |
| Current International
Class: |
H01Q
9/04 (20060101); H01Q 1/38 (20060101); H01Q
21/00 (20060101); H01Q 001/38 (); H01Q
013/10 () |
| Field of
Search: |
;343/769,814,846,854
;29/601 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Lieberman; Eli
Attorney, Agent or Firm: Sharkansky; Richard M. McFarland;
Philip J. Pannone; Joseph D.
Government Interests
The invention herein described was made in the course of or under a
contract or subcontract thereunder, with the Department of Defense.
Claims
What is claimed is:
1. The method of forming a conformal array antenna comprising the
steps of:
a. forming a plurality of array modules, each one being formed
by:
i. etching simultaneously on one surface of a flexible dielectric
sheet, an array of radiating elements, a ground plane for such
elements, a corporate feed network for such elements and a portion
of a parallel plate lens coupled to the feed network;
ii. folding such dielectric sheet around a stiffener including:
disposing the plurality of radiating elements in a first plane,
and, positioning the ground plane behind the radiating elements in
a plane orthogonal to the first plane; and
iii. bonding such folded dielectric sheet to such stiffener;
and
b. arranging the plurality of array modules around a predetermined
conformal surface.
Description
BACKGROUND AND SUMMARY OF THE INVENTION
This invention relates generally to radio frequency array antenna
structures and methods for fabricating such structures.
As is known in the art, it is generally highly desirable to provide
light weight inexpensively fabricated radio frequency array antenna
structures. According to this invention such an array antenna
structure is provided by forming, on one or more relatively
flexible dielectric sheets, a plurality of radio frequency circuits
comprising a radiating array face of an array antenna and feed
networks and then bonding such dielectric sheet (or sheets) to a
suitable core material to form a complete array antenna structure
which is light in weight, is inexpensive to fabricate and is
structurally sound.
In one embodiment a planar array antenna is fabricated by using two
dielectric sheets. One of such dielectric sheets has a conductive
ground plane formed on one side and a plurality of corporate feed
networks formed on the other side; the other one of such dielectric
sheets has a plurality of annular slots etched from a ground plane
formed on one side thereof. The two dielectric sheets are bonded
together to form a stripline structure with the corporate feed
networks on the one and annular slots on the other being in
registry to form the radiating elements of the desired array
antenna. The bonded dielectric sheets are then bonded to at least
one stiffener (or core) to provide the desired completed array
antenna.
In a second embodiment a conformal array is formed by arranging a
plurality of array modules side-by-side around a predetermined
conformal surface. Each one of the array modules includes a
flexible dielectric sheet (or substrate) having simultaneously
formed thereon circuitry which comprises an array of radiating
elements, a ground plane for such elements, a corporate feed
network and a portion of a parallel plate lens coupled to the feed
network. The dielectric substrate with the circuitry formed thereon
is folded around, and bonded to, a suitably shaped core to provide
structure integrity to each array module.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a flat planar array antenna according to the
invention;
FIG. 2 is an exploded view of an exemplary one of the radiating
elements of the antenna shown in FIG. 1;
FIGS. 3-5 are planar views of portions of panels used to form the
radiating elements, an exemplary one thereof being shown in FIG.
2;
FIG. 6 is a conformal array antenna according to the invention;
FIG. 7 is a layout of a sheet used in forming an array module of
the antenna shown in FIG. 6;
FIG. 8 is an end view of one of the array modules of the antenna
shown in FIG. 6;
FIG. 9 is a perspective view of two adjacent array modules having
blocks of core material removed;
FIG. 10 is a fragmented view, partially in cross-section, showing
the interconnection between a coaxial connector and a feed port for
the array module; and
FIG. 11 is a perspective view of an oval-shaped assembly used in
the array module.
DESCRIPTION OF THE PREFERRED EMBODIMENTS
Referring now to FIG. 1, a flat planar array antenna 10 is shown to
include a plurality of identical radiating elements 12. An
exemplary one of such radiating elements is shown in FIG. 2 and is
of the type described in U.S. Pat. No. 3,665,480 issued May 23,
1972, Inventor M. Fassett, and assigned to the same assignee as the
present inventor. Such radiating element 12 includes: A stripline
circuit 14; a core structure 16, here polyurethane structural foam;
and, a radome board 18, here a panel of epoxy fiberglass board.
The stripline circuit 14 includes two teflon fiberglass stripline
sheets, 20, 22. Sheet 22, shown partially in FIG. 3, has a
plurality of annular slots 24 etched from copper cladding 25 on one
surface (which also forms one ground plane of the stripline
circuit). Each one of such slots 24 provides an aperture for a
corresponding one of the radiating elements 12 as described in the
referenced U.S. Pat. No. 3,665,480. Sheet 20 is partially shown in
FIG. 4. Such sheet 20 is initially clad on both sides with copper
and then copper on one side is etched to form a plurality of feed
networks 21 for the radiating elements. The feed networks 21 on
sheet 20 and the circular slots 24 on sheet 22 are held in proper
registry using any conventional alignment procedure, and then press
bonded in a conventional manner to form a stripline circuit panel.
The feed networks 21 then are the center conductor circuits of the
stripline circuit 14. Radio frequency conductors 28 and mode
suppression eyelets 30 are installed after bonding of the stripline
panel in any conventional manner thereby completing fabricating of
the stripline circuit 14. It is here noted that the plurality of
feed networks 21 is formed simultaneously on the sheet 20 and
likewise the radiating element apertures 21 are formed
simultaneously on the sheet 22.
Radome board 18 shown partially in FIG. 5 has a plurality of copper
disks 32 having a diameter equal to the inner diameter of the
annual slot 21 formed thereon by the conventional etching process
discussed above. The copper disks are aligned coaxially with
corresponding annular slots 24 using any conventional alignment
procedure. Then the stripline circuit 14, core structure 16 and
radome board 18 are bonded together to form a laminated
structure.
Referring now to FIG. 6 a cylindrical array antenna 34 capable of a
360.degree. scan is shown. Such array antenna 34 here is an L-band
design 38 feet in diameter and 8 feet high. The face of the array
antenna 34 is made up of a plurality of identical array modules 36,
here 192 in number, each one bonded in a convenient manner around
the periphery of a cylindrical mount 37.
Each one of the modules 36 is constructed by etching,
simultaneously, in a single etching process on a thin copper clad
sheet of flexible substrate, here Mylar, measuring approximately 36
inches wide and 96 inches long, 16 half-wave dipole radiating
elements 38, a ground plane 40, a strip section 42 of a constrained
lens of the type described in U.S. Pat. No. 3,761,936, "Multi-Beam
Array Antenna", D. H. Archer, R. J. Prickett and C. P. Hartwig,
inventors, issued Sept. 25, 1973 and assigned to the same assignee
as the present invention, and RF transmission lines 44 (here
conventional twin lines but indicated by single lines) as shown in
FIG. 7. Here such strip section 42 has four input ports 45a, 45b,
45 c, 45d, with input ports 45a, 45b and 45c interconnected during
the etching process. Further, feed ports 47, 49 are also formed
during the etching process, feed port 47 being connected to output
ports 45a, 45b and 45c, as shown, feed port 49 being connected to
output port 45d, as shown. A generally oval-shaped assembly 48
(shown in FIG. 11 to include a dielectric material 51 with a copper
ground plane 53 formed on one side thereof and a duplicate 42' of
the strip section 42 formed on the other side thereof) serves as
the constrained lens described by Archer et al. The duplicate strip
section 42' is affixed with a suitable conductive epoxy to the
strip section 42 formed on the Mylar substrate so that the ground
plane 53 serves as the ground plane for the strip section 42 and
the duplicate strip section 42'. The Mylar sheet forming the array
module 36 (together with the affixed oval-shaped assembly 48) is
then wrapped around and bonded to two blocks of core material, 52,
54 (FIG. 8), here polystyrene foam, to provide structural integrity
to the module. The block 54 may have a groove formed in the bottom
to provide space for the oval-shaped device 48. Referring again to
FIG. 9, a pair of adjacent array modules 36 are shown with the two
blocks of core material 52, 54 removed. From FIG. 9 it is evident
that, because adjacent ones of the ground planes 40 have 16 mating
semicircular shaped grooves 56, the Mylar dielectric material of
adjacent modules electrically insulate RF transmission lines 44
from the ground plane 40.
Each array module 36, then, may be considered to be a linear array
having the 16 dipole elements 38, a conductive ground plane 40
disposed behind the elements 38, an RF microstrip lens for
elevation beam forming, and RF transmission lines 44 to
interconnect the dipole elements 38 and the lens. The 16 grooves 56
on the lower side of the ground plane are provided to enable
electrical isolation between the RF transmission lines 44 of one
array module 36 and the ground plane 40 of the adjacent array
module 36 as discussed and shown in FIG. 9. Because of the small
spacing (intervals of wavelengths) between the individual ground
planes 40, such ground planes act as one continuous ground plane
for the cylindrical conformal array 34 when the array modules 36
are mounted adjacent one another to form such cylindrical array 34
(FIG. 6).
Completing the exemplary array module 36 after the sheet is bonded
to the two blocks 52, 54 of core material, the ends of the module
are sealed with caps (not shown) here of Mylar, to produce a sealed
module. Referring now to FIG. 10 a coaxial connector fitting 60 is
shown having its center conductor 62 in electrical contact with the
strip section 42 and the duplicate strip section 42' and the outer
conductor 64 in electrical contact with the ground plane 53. The
coaxial connector fitting 60 is bonded to the block 54 using any
suitable epoxy.
Although preferred embodiments of the invention have been described
in detail, it is to be understood that various changes,
substitutions and alterations can be made therein without departing
from the spirit and scope of the appended claim.
* * * * *